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激光微纳加工系统

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激光微纳加工系统

Item

Descriptions


Transport X-Y-θ-Z Stage & Chuck

1

X-axis

Travel :    200mm, 1um accuracy, Res:   0.1um

2

Y-axis

Travel :    200mm, 1um   accuracy, Res: 0.1um

3

Z-Axis

Travel :    +/-10mm, 1um   accuracy, Res: 0.1um

4

q Stage

Travel :  120°,  0.02° accuracy,  Res:  0.001°

5

Stage speed

X dir.:     150mm/s     Y dir.:  150mm/s

6

Chuck Size

Vacuum chuck; 6” wafer


System Requirements

1

Wafer Size

6”-15‘’ maximum

2

Throughput

TBD

3

Process Chamber Illumination

Yes

4

Debris removal

Include low flow debris removal –air blow   15-20 psi

5

Power Distribution Unit (PDU)

Included


PC And Interface Requirements

1

Computer

Industrial PC; Windows operating system

2

System Interface

Keyboard, Mouse

3

Software Features

Recipe Based, 2-level login access

4

Image recognition Capability

Embedded in Software


Facility Requirements

1

Equipment Dimensions

1m x1m x1.8m (estimated)

2

Weight

TBD

3

Working Environment

100K cleanroom

4

Laser System Safety

Class-I

5

Air Supply

CDA, 25-20 psi

6

Vacuum

Equipped with vacuum generator

7

Exhaust for Debris Removal

Exhaust connection required

8

Power Supply

110 or 220VAC input, 8kW max

Factory configurable


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